Multilayer chip inductors  MI

  SOLDERABILITY

  More than 90% of the terminal

  electrode shall be covered with

  fresh solder.

  SOLDER :   H 63A ( eutectic solder )

  SOLDER TEMPERATURE :  230C+- 5C.

  FLUX :  ROSIN

  DIP TIME :   3+-1SEC.

  SOLDERING HEAT

  RESISTANCE

  The chip shall not crack.  More

  than 75% of the terminal electrode

  shall be covered with solder.

  SOLDER :   H 63A ( eutectic solder )

  SOLDER TEMPERATURE :  260C+- 5C.

  FLUX :   ROSIN

  DIP TIME :  10+- 1SEC.

  BENDING STRENGTH

  The ferrite shall not be damaged

  by forces applied on the right.

TYPE

A ( mm )

KGF

MI-160808

1.0

0.6

MI-201209

1.4

1.0

MI-201212

1.4

2.0

MI-321611

2.0

2.0

  THERMAL SHOCK

  (TEMPERATURE CYCLE)

    No mechanical damaged.

   Inductance shall be within +- 5% of

   the initial value and Q shall be

   within +- 30% of the initial value.

  TEMPERATURE : - 40C, + 85C for 30

                            minutes each, 100 cycles.

  TEMPERATURE : + 40C

  HUMIDITY :      95%RH

  TIME :     1000+-12 hours

  HIGH TEMPERATURE 

  RESISTANCE

  TEMPERATURE :  +85C+ - 2C

  TIME :      1000+-12 hours

  RESISTANCE

  TEMPERATURE : +40C+ - 2C

  TIME :     1000 + -12 hours