| MECHANICAL PERFORMANCE TEST | ||||
| ITEM | SPECIFICATION | TEST CONDITION | ||
|
SOLDERABILITY |
More than 90% of the terminal electrode shall be covered with fresh solder. |
SOLDER : H 63 A ( EUTECHTIC SOLDER ) SOLDER
TEMPERATURE : 230 FLUX : ROSIN DIP TIME : 3+-1 SECONDS |
||
|
SOLDERING HEAT RESISTANCE |
The chip shall not crack. More than 75% of the terminal electrode shall be covered with solder. |
SOLDER : H 63 A ( EUTECHTIC SOLDER ) SOLDER
TEMPERATURE : 260 FLUX : ROSIN DIP TIME : 10+- 1 SECONDS |
||
|
TERMINAL STRENGTH |
The terminal electrode shall not break off nor the ferrite damage. |
TYPE | KGF | TIME(SEC) |
| SMT-160808 | 0.6 | 30+- 5 | ||
| SMT-201209 | 0.6 | |||
| SMT-321611 | 1.0 | |||
| SMT-321616 | 1.0 | |||
| SMT-322513 | 1.0 | |||
| SMT-451616 | 1.0 | |||
| SMT-453215 | 1.6 | |||
|
BENDING STRENGTH |
The ferrite shall not be damaged by forces applied on the right. |
TYPE | A( mm) | KGF |
| SMT-160808 | 1.0 | 0.6 | ||
| SMT-201209 | 1.4 | 1.0 | ||
| SMT-321611 | 2.0 | 2.0 | ||
| SMT-321616 | 2.0 | 2.5 | ||
| SMT-322513 | 2.0 | 2.5 | ||
| SMT-451616 | 2.5 | 2.5 | ||
| SMT-453215 | 2.7 | 2.5 | ||
C+-5